Description
Reps of: Manual/semi automatic/automatic solder paste printer, Automatic programmable solder paste/glue dispenser with PCB drilling facility, Manual/semi-automatic/automatic SMD pick and place systems, Forced convection reflow soldering system from Benchtop 3 zones to floor model up to 20 heating zones, Automatic/semi automatic SMD/BGA/flip chip rework station, Standalone/in-line X-ray inspection systems, Standalone/automatic (with cassette loader and unloader), Thick film printers, Radiant dryer, standalone/in-line with furnace, Fast fire (muffle less)/muffle thick film firing furnace for single/double sided HMCs, Microwave plasma cleaning systems, Plasma drilling system for PCBs and High density substrates, Plasma desmearing system for multilayer PCBs, X-ray inspection for multilayer PCBs, Wet chemical stations, Spin rinser/dryer, Microwave plasma ashing (stripping) system, Stack/belt diffusion furnace, Standalone/fully automatic cassette to cassette printer for silicon wafers, High temperature belt/pusher furnace for ceramics, Hermetic sealing, Contact firing, Annealing and sintering, Microwave plasma etching system, Atmospheric chemical vapour deposition (APCVD) system. Dir: Mayank Pandit.
Location
Post Box 7754, Mulund (W), Mumbai, Maharashtra
