Leaptech Corporation

Principals: (1) i.Pulse Co. Ltd, Japan for High speed chip shooters, Multi mounters, Mini module mounters, Glue dispensers, AOI systems and X-ray - AOI combi systems; (2) Deprag Schulz GmBH, Germany for Assembly automation solutions, Screwdriving Technology, Screwdriving automation, Torque measurement devices, Pneumatic power tools and Air motors; (3) Vergason Technology, Inc. USA for Vacuum coating systems, Cathodic arc/sputtering systems, Metalisation and Hard coat systems; (4) Tangteck Equipment Inc., Taiwan for Air/Nitrogen SMD reflow ovens, Drying furnaces (hybrids/solar), Firing furnaces (hybrids/semicon/solar) and Thermotracker thermal profiler; (5) National Solbot Electronics, Taiwan for Lead free wave soldering machines, Selective wave soldering machines and Spray fluxers; (6) Fonton Industrial Co. Ltd, Taiwan for Split vision BGA rework stations, SMD rework stations and BGA revalling kits; (7) Getech Automation Pte Ltd, Singapore for Semi automatic CPB depenelling machine, Fully automatic CPB depanelling machine; (8) Asia Kinetron Pte Ltd, Singapore for PCB handling equipment, Manual insertion conveyor systems and Final assembly conveyor systems; (9) CAB Elektronik GmbH, Germany for PCB separation machines; (10) Eun Seong F.A. Co. Ltd, Korea for Axial component inserters (large), Eyelet/gripper/pin/TAB inserters and Cut & Clinch machines; (11) Tecnicon Precision Ltd, UK for Paste height measurement systems, Paste data analysis systems; (12) Okano (S) Pte Ltd, Singapore for In-circuit testers (MDA), Acculogic flying probers and Jigs & fixtures; (13) XYZTEC BV, The Netherlands for Multifunction bond testers; (14) Consumable/Spare parts for Wave soldering pallets, Reflow soldering pallets, Splicing tools/tapes and A1 machine spare parts. Dir: Suresh Nair